AI never sleeps. And neither do data centres. As rack densities surge toward 600kW and cooling consumes up to 40 per cent of total energy, traditional air cooling is hitting its limits. The industry needs a new blueprint – one that combines liquid cooling at scale, AI-driven optimisation, water efficiency, and regulatory compliance – all while keeping operations resilient and cost-effective.
Join us on November 9–10, 2026 in Frankfurt, Germany, at the Europe Data Center Cooling and Thermal Management Forum 2026 – where industry leaders, technology innovators, and decision-makers come together to shape the next generation of resilient, efficient, and scalable cooling solutions for the AI era.
🌟 25+ expert speakers – real conversations, real case studies
🌟 20+ deep-dive sessions across 2 days
🌟 200+ attendees across the value chain
🌟 10+ hours of dedicated networking with decision-makers
Our agenda spans the entire thermal ecosystem – from chip-level emulation and liquid cooling architectures to site selection, waste heat recovery, and grid constraints.
What you will learn:
1. Scale Liquid Cooling – From Direct‑to‑Chip and immersion to hybrid architectures – real-world deployment strategies.
2. Optimise PUE & WUE – Practical approaches to reduce energy and water usage while meeting tightening EU regulations (EnEFG, 42nd BImSchV).
3. Retrofit for AI Workloads – How to upgrade legacy air‑cooled facilities for high‑density GPU computing using CFD and modular designs.
4. Unlock Waste Heat Revenue – Integrate data centre heat recovery into urban energy systems – turning a cost into a profit centre.
5. Prepare for Next‑Gen Chips – Thermal challenges of 1800W‑2000W class processors and how to design “liquid‑first” infrastructure.
6. Navigate Grid & Water Constraints – Site selection, power availability, and resilience planning for extreme weather and capacity expansion.
This forum gathers a high-level audience across the ecosystem. Already confirmed delegates include:
AtlasEdge, Data4, Vantage Data Centers, Green Mountain, Telehouse, Maincubes, Mainova WebHouse, GreenScale, Kevlinx, nLighten, STACK Infrastructure, Yondr, Portus Data Centers, Apple ApS, Daikin, Danfoss, ebm-papst, HYDAC, Rittal, Wilo, Siemens, ABB, Eaton, Nidec, Atlas Copco, Sensata Technologies, Vaisala, Endress+Hauser, Shell, Molex, Johnson Controls, INWATEC GmbH & Co. KG, DYNACAST, Yokogawa, Nalco Danmark ApS, API Heat Transfer, Grundfos GmbH, E+E Elektronik Deutschland GmbH, Watson Marlow Fluid Technology Solutions, DBI Plastics Group A/S, Salute
…and many more. Full list available on the event website.
Event website: https://www.ecv-events.com/EDCCTMF2026?cci=34
Contact us at: marketing@ecvinternational.com
Kontak sponsor/pameran
ECV International
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